Intel, the world's biggest chipmaker, has detailed a triple-pronged assault on a mobile phone market it has so far failed to crack, with new chipsets, flash memory products and further development of the WiMAX standard on the way.

Sean Maloney, head of its recently formed Mobility Group, told the Intel Developer Forum in San Francisco on Wednesday that its first chipset for third-generation phones to ship in volume codenamed Hermon would appear this year.